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SOLD!

F&K M17LSB ULTRASONIC LASER BONDER WIRE BONDER USED

$25,000.00
Availability:

Out of stock
BRAND: F&K MODEL: M17LSB CONDITION: used
SKU: IGAM1240011 Weight: 999 lbs Freight (Item Must Ship Freight)

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Overview

The F & K Delvotec M17LSB Ultrasonic Laserbonder is a used advanced wire bonding and micro-welding system, tailored for high-precision electronic and power module manufacturing. Designed to handle a wide range of materials and bonding applications, this hybrid ultrasonic and laser bonding platform combines the precision of laser welding with the adaptability of ultrasonic techniques. Featuring customizable laser wavelengths, microsecond pulse control, and a generous work envelope, the M17LSB supports fine-pitch bonding, battery tab welding, and other high-density interconnect applications with reliable speed and accuracy.

Specification Table

Unit 80x77x82 (GENERAL) Controls 50x31x80

Product Specifications

  • Model: F & K Delvotec M17LSB Ultrasonic Laserbonder

  • Laser Type: Pulsed laser (DPSS or fiber-based)

  • Supported Wavelengths:

    • ~Standard: 1064 nm (Nd:YAG)

    • ~Optional: 532 nm (green), 355 nm (ultraviolet)

  • Laser Power:

    • ~Up to 100 W (depending on module)

    • ~Adjustable pulse energy and duration

  • Pulse Duration: Microsecond range, precision configurable

  • X/Y Travel Area: Up to 300 mm x 300 mm

  • Z-Axis Clearance: Supports parts up to approx. 80 mm tall

  • Bonding Speed: 1–3 bonds per second

  • Laser Dwell Time: 100–300 milliseconds per bond

 

Key Features

  • Ultrasonic + laser bonding capability for versatile bonding solutions

  • Microsecond pulse modulation for precise thermal control

  • Wide-area bonding support with 300 x 300 mm travel

  • Advanced automation features including fiducial recognition and auto-calibration

  • Flexible wavelength options for bonding different materials

  • Robust pattern recognition system improves alignment and accuracy

  • Configurable for a wide range of applications, from fine wires to structural tabs

 

Applications

  • Battery tab bonding in EVs and power storage systems

  • Wire bonding for semiconductor and LED assembly

  • Photovoltaic module production requiring precision interconnects

  • Hybrid electronics and medical device bonding

  • Precision welding in aerospace-grade microelectronics

 

Alternative model numbers include: Delvotec M17LSB Ultrasonic Laserbonder, F&K M17 LSB Bonding Machine, Delvotec 17LSB Hybrid Bonder, M17 LSB Ultrasonic Laser Wire Bonder, F&K Delvotec M17 Series Bonding Unit

Common misspellings include: Delvotek M17LSB, F & K Delvatec M17LSB, F-K M17 LSB Bonder, Delvotec ML7LSB, Delvotec M17USB

INDUSTRY EXPERTS

INDUSTRY EXPERTS

Decades of Equipment Knowlege.

Shipping

Shipping

Parcel Orders Shipped within 24 hrs. Monday thru Friday.

Customer Service

Customer Service

Local Customer Service Reps.