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2020 F&K M17LSB ULTRASONIC LASER BONDER WIRE USED 0
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SOLD!

2020 F&K M17LSB ULTRASONIC LASER BONDER WIRE USED

$25,000.00
Availability:

1 in stock
BRAND: F&K MODEL: M17LSB CONDITION: used
SKU: IGAM1240012 Weight: 999 lbs Freight (Item Must Ship Freight)

1 in stock

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Overview

The F & K Delvotec M17LSB Ultrasonic Laserbonder is a used hybrid bonding system that integrates ultrasonic and laser bonding technologies to deliver high-precision connections for microelectronics, battery, and semiconductor applications. This unit is functional but includes a damaged key switch, which may require replacement for full operational readiness. With flexible laser wavelength options, microsecond-level energy control, and a large bonding workspace, the M17LSB is ideal for fine-pitch, high-density, and complex geometries. Designed with automation in mind, it features advanced calibration tools and vision systems to support high-throughput environments.

Specification Table

Unit 80x77x82 (GENERAL) Controls 50x31x80

Product Specifications

  • Model: F & K Delvotec M17LSB Ultrasonic Laserbonder

  • Laser Type: Pulsed (DPSS or fiber)

  • Wavelength Options:

    • ~Standard: 1064 nm (Nd:YAG)

    • ~Optional: 532 nm (green), 355 nm (UV)

  • Laser Power:

    • ~Up to 100 W max output (varies by configuration)

    • ~Adjustable pulse energy and duration

  • Pulse Duration: Microsecond range

  • X/Y Travel Area: Up to 300 mm x 300 mm

  • Z-Axis Clearance: Approx. 80 mm (configurable)

  • Bonding Speed: 1–3 bonds per second

  • Laser Dwell Time: 100–300 ms per bond

  • Notable Condition Detail: Damaged key switch

 

Key Features

  • Hybrid ultrasonic and laser bonding for enhanced material versatility

  • Microsecond-level energy control for fine-pitch bonding precision

  • Wide-area support for larger or complex assemblies

  • Advanced vision and calibration tools reduce cycle times

  • Multiple laser wavelengths for broad material compatibility

  • Supports aluminum, copper, nickel, and specialty alloys

  • Ideal for production-scale or prototyping environments

 

Applications

  • Battery tab bonding for EV, power tools, and energy storage

  • Wire bonding and die attachment in semiconductor fabrication

  • Precision micro-welding for medical and aerospace devices

  • High-density PCBs and power modules

  • Advanced research labs needing precision bonding solutions

 

Alternative model numbers include: Delvotec M17LSB Ultrasonic Laser Bonder, F&K M17 LSB Hybrid Welder, Delvotec 17LSB Wire Bonder System, M17 LSB with Laser and Ultrasonic Capabilities, F&K M17 Series Micro Welding Machine

Common misspellings include: Delvotek M17LSB, F & K Delvatec M17LSB, F-K M17 LSB, Delvotec ML7LSB, Delvotec M17USB

INDUSTRY EXPERTS

INDUSTRY EXPERTS

Decades of Equipment Knowlege.

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