F&K DELVOTEC M17LSB ULTRASONIC LASER BONDER

$25,000.00

Availability:

Out of stock

BRAND: F&K MODEL: M17LSB CONDITION: used
SKU: IGAM1240010 Weight:999 LBS 999 lbs Freight (Item Must Ship Freight)

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About This Item

Product Specifications

Model: M17LSB
Bonding Method: Ultrasonic and laser hybrid bonding
Bond Head Type: Multi-axis precision wire bonding head
Wire Types Supported: Gold, aluminum, copper
Wire Diameters: Supports a wide range of diameters for various applications
Bonding Modes: Ball, wedge, and laser-stitch options
Control Interface: Integrated touchscreen with programmable software
Vision System: High-resolution optical alignment for target accuracy
Power Requirements: Standard industrial power configurations
Dimensions: Compact footprint optimized for lab or production floor use

Key Features

Combines ultrasonic and laser bonding in a single platform
High-speed, high-accuracy bonding performance
Advanced pattern recognition and optical alignment system
Versatile wire compatibility for multiple interconnect strategies
Customizable bond parameters for varying material and package types
Durable frame with vibration isolation for precision bonding
User-friendly programming environment for efficient operation
Ideal for R&D, prototyping, and volume production environments

Applications

Semiconductor chip packaging
Power electronics interconnects
Automotive sensor and module assembly
RF and microwave device bonding
Medical device micro-assembly

Alternative model numbers include: F&K M17LSB, Delvotec M17 LSB, M17LSB Wire Bonder, F&K Laser Ultrasonic Bonder, M17LSB Hybrid Bonder
Common misspellings include: M17LS, M17LS8, FK DELVOTEC M17, Delvotek M17LSB, M17LBS